High Density Interconnect PCB (HDI)
HDI PCB's are multilayer PCB's with even higher density of circuity. Increased density is achieved by finer line and spaces and by utilising specialist via hole technology.
Unlike conventional Multilayer PCB's where via holes go through all layers, HDI PCB's connect specific layers by using microvia (100µm dia) holes formed by laser drilling. There are multiple types of via hole structures including, blind, buried, stacked, staggered and back drill.
Layer count of HDI PCB's range from 6 layer to around 24 layers or more.
Our HDI facility has vast experience and high capability in producing some of the most advanced PCB's in the market. Continual investment to meet every growing demand for this technology.
Highlights:
● Layer structure - any Layer/4+n+4/3+n+3/2+n+2/1+n+1
● Via type: Filled/Stacked/Skipped/Via In Pad/Blind/Buried/Backdrill
● Layer count 4 to 24 Layers
● FR4 (including, High performance, Halogen Free and low loss materials), Ceramic & FR4 / Ceramic Hybrid
● PCB thickness from 0.5 to 4.5mm
● Copper weights upto 70µm (2oz)
● All surface finishes available
● Outlines include CNC routing, V-Scoring
● Line and Space 0.076mm / 0.076mm
