Silver Through Hole
Double layer PCB where the through hole connection is made by conductive silver paste. This technology was developed as a low-cost alternative to traditional copper through hole plating. Used in a variety or markets / applications from consumer to some low-end automotive applications.
All production volumes supported utilising our semi-automatic production lines.
Highlights:
● Materials CEM1, CEM3 and FR4
● Outlines include CNC routing, Punching, V-Scoring and Push back technology
● All surface finishes available
● Silver Jumper capability
● CTI values ranging from 175 to 600V
● Soldermask - UV or Thermal cure
